Springer Science+Business Media, New York, 2013. VIII, 100 p. 83 illus., 16 illus. in color. — ISBN: 978-1-4614-3115-2, ISBN: 978-1-4614-3116-9 (eBook), DOI 10.1007/978-1-4614-3116-9 — (Series: SpringerBriefs in Applied Sciences and Technology).
Discusses heat treatment strategies for bonding tools
High Performance Grinding and Advanced Cutting Tools discusses the fundamentals and advances in high performance grinding processes, and provides a complete overview of newly-developing areas in the field. Topics covered are grinding tool formulation and structure, grinding wheel design and conditioning and applications using high performance grinding wheels. Also included are heat treatment strategies for grinding tools, using grinding tools for high speed applications, laser-based and diamond dressing techniques, high-efficiency deep grinding, VIPER grinding, and new grinding wheels.
Content Level » Research
Keywords » Creep feed - Cutting tools - Grinding tools - Grinding wheel design - Grinding wheels- Machine tools
Related subjects » Mechanical Engineering - Production & Process Engineering - Special types of Materials
Abrasive Tools and Bonding SystemsAbrasive Grain Characteristics
Grain Shape
Attritious Wear Factors
Grain Fracture Toughness
Silicon Carbide
Fused Alumina
Grain Types
Alumina–Zirconia
Engineered Alumina Abrasives
Ceramic Sol-Gel Based Abrasives
Agglomerated Grain
Superabrasives
Diamond
Vitrified Bonding Systems and Heat TreatmentVitrified Bonding Systems
Grinding Wheel Structure Formation During Heat Treatment
Physicochemical Processes That Occur During Firing
Ceramic Bond Minerals That Form During Firing
Case Study I: Interfacial Compounds and Their Effect on Grinding Wheel Wear
Wear Mechanisms
Microstructure of Abrasive Grains
Experimental Procedure
Experimental Results
Discussion of Interfacial Compounds on Grinding Wheel Wear
Case Study II: Dissolution of Quartz and Its Effect on Grinding Wheel Wear
Dissolution Models for Vitrified Grinding Wheel Bonds
Experimental Procedures
Experimental Results
Discussion
Conclusions