Doane D.A., Franzon P.D. (Eds.) Multichip Module Technologies and Alternatives: The Basics

Springer, 1993. — 896 p. — ISBN: 978-1-4615-3100-5.Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
While there are several books now on packaging, these books deal with the subject of multichip modules as part of packaging in general, or they treat a particular multichip module technology or they are at an advanced level. What is needed, therefore, is a comprehensive book at the basic level, structured so that anyone entering the field can quickly learn about the technologies, understand the tradeoffs, review the product examples, and make systems level decisions.
Such a book has been provided by Daryl Ann Doane and Paul D. Franzon. They have worked with an outstanding team of packaging experts from industry and universities. Together they have produced Multichip Module Technologies and Alternatives: The Basics, an outstanding book for both industry and university use. It is equally appropriate as an introduction to the multichip module technologies for those just entering the field, and as an up-to-date basic technical book for those currently practicing in it.
The books deals with the subject of multichip modules along three parts:
systems level perspectives including packaging technology options and costs, the basics of ceramic, thin film and printed wiring board technologies as well as chip and module level connections; thermal and electrical design considerations including electrical testing; and finally product examples illustrating how multichip modules have been useful.
The basic and integrated nature of the book clearly reflects the dedication and the hard work of the editors and the authors.